Sputtering Targets

First reported by Grove in 1852 and Plucker in 1858, sputtering is a process whereby gas ions accelerated by a high voltage bombard a target and cause ejection of particles of atomic dimensions from the target material. The material is freed from the target then deposits on a nearby surface. If you are looking to move particles by way of sputtering, the RD Mathis Company offers you a wide selection of sputtering targets in a variety of diameters, purities and thicknesses.

Custom Sizes and Materials

You will see below some of our standard sizes of 2″, 3” and 4” Sputtering Targets. Other sizes of 5”, 6”, 8” and mm sizes, as well as custom sizes, are available on request. We also offer hard to find materials and alloys to meet your specific needs. Take a look at our selection below and let us know if you have any questions.

All dimensions are ±.010”.