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First reported by Grove in 1852 and Plucker in 1858, sputtering is a process whereby gas ions accelerated by a high voltage bombard a target eject particles of atomic dimensions from the target material. Material is freed from the sputtering targets, depositing on nearby surfaces.
Targets are offered in many standard diameters, thicknesses, and material purities.
Contact our sales team about sourcing availability for difficult-to-find target materials & alloys. Sizes of 5”, 6”, 8” and mm sizes, as well as custom sizes can also be provided.
